Development Board: TMS570LS31x Hercules Development Kit from TI http://www.ti.com/tool/tmds570ls31hdk Drivers: o Console o Clock o Ethernet - work in progress BSP variants: tms570ls3137_hdk_intram - place code and data into internal SRAM tms570ls3137_hdk_sdram - place code into external SDRAM and data to SRAM tms570ls3137_hdk - variant prepared for stand-alone RTEMS application stored and running directly from flash. Not working yet. Tool-chain GCC 4.9.0 + Newlib 2.1.0 + Binutils 2.24 configuration: CFLAGS="-O2 -pipe" LDFLAGS=-s \ ../../../src/gcc-4.9/configure --target=arm-rtems4.11 --prefix=/usr \ --enable-languages=c,c++ \ --disable-libstdcxx-pch \ --with-gnu-ld \ --with-gnu-as \ --enable-threads \ --enable-target-optspace \ --with-system-zlib \ --verbose \ --disable-nls --without-included-gettext \ --disable-win32-registry \ --with-newlib \ --enable-plugin \ --enable-newlib-io-c99-formats \ --enable-version-specific-runtime-libs \ --enable-newlib-iconv \ --disable-lto \ Patches required for Cortex-R and big-endian ARM support are already accepted by the mainline. Execution Currently, a bootloader is not used. For test and debug purposes, TI's HalCoGen generated application is used to set up the board and then the RTEMS application image is loaded using OpenOCD to internal EEC SRAM or external DRAM. The following features are not implemented in the BSP: + Initial complex CPU and peripheral initialization + Cores Self-test Setup application code is available there: https://github.com/hornmich/tms570ls3137-hdk-sdram Howto setup TMDS570LS31HDK? o Unpack board. o Verify that demo application runs. o Upload bootloader specified above o write BSP application either to sdram or intram and jump to RTEMS start code Additional information about the board can be found at http://www.rtems.org/wiki/index.php/Tms570 Additional information about the CPU can be found at http://www.ti.com/product/tms570ls3137