source: rtems/bsps/powerpc/mvme3100/include/bsp/mpc8540_i2c_busdrv.h @ 2afb22b

5
Last change on this file since 2afb22b was 2afb22b, checked in by Chris Johns <chrisj@…>, on Dec 23, 2017 at 7:18:56 AM

Remove make preinstall

A speciality of the RTEMS build system was the make preinstall step. It
copied header files from arbitrary locations into the build tree. The
header files were included via the -Bsome/build/tree/path GCC command
line option.

This has at least seven problems:

  • The make preinstall step itself needs time and disk space.
  • Errors in header files show up in the build tree copy. This makes it hard for editors to open the right file to fix the error.
  • There is no clear relationship between source and build tree header files. This makes an audit of the build process difficult.
  • The visibility of all header files in the build tree makes it difficult to enforce API barriers. For example it is discouraged to use BSP-specifics in the cpukit.
  • An introduction of a new build system is difficult.
  • Include paths specified by the -B option are system headers. This may suppress warnings.
  • The parallel build had sporadic failures on some hosts.

This patch removes the make preinstall step. All installed header
files are moved to dedicated include directories in the source tree.
Let @RTEMS_CPU@ be the target architecture, e.g. arm, powerpc, sparc,
etc. Let @RTEMS_BSP_FAMILIY@ be a BSP family base directory, e.g.
erc32, imx, qoriq, etc.

The new cpukit include directories are:

  • cpukit/include
  • cpukit/score/cpu/@RTEMS_CPU@/include
  • cpukit/libnetworking

The new BSP include directories are:

  • bsps/include
  • bsps/@RTEMS_CPU@/include
  • bsps/@RTEMS_CPU@/@RTEMS_BSP_FAMILIY@/include

There are build tree include directories for generated files.

The include directory order favours the most general header file, e.g.
it is not possible to override general header files via the include path
order.

The "bootstrap -p" option was removed. The new "bootstrap -H" option
should be used to regenerate the "headers.am" files.

Update #3254.

  • Property mode set to 100644
File size: 2.3 KB
Line 
1/**
2 *  @file
3 *
4 *  @ingroup powerpc_mpc8540i2cbusdrv
5 *
6 *  @brief I2C bus driver for mpc8540-based boards
7 */
8
9#ifndef MPC8540_I2C_BUS_DRIVER_H
10#define MPC8540_I2C_BUS_DRIVER_H
11
12/*
13 * Authorship
14 * ----------
15 * This software ('mvme3100' RTEMS BSP) was created by
16 *
17 *     Till Straumann <strauman@slac.stanford.edu>, 2005-2007,
18 *         Stanford Linear Accelerator Center, Stanford University.
19 *
20 * Acknowledgement of sponsorship
21 * ------------------------------
22 * The 'mvme3100' BSP was produced by
23 *     the Stanford Linear Accelerator Center, Stanford University,
24 *         under Contract DE-AC03-76SFO0515 with the Department of Energy.
25 *
26 * Government disclaimer of liability
27 * ----------------------------------
28 * Neither the United States nor the United States Department of Energy,
29 * nor any of their employees, makes any warranty, express or implied, or
30 * assumes any legal liability or responsibility for the accuracy,
31 * completeness, or usefulness of any data, apparatus, product, or process
32 * disclosed, or represents that its use would not infringe privately owned
33 * rights.
34 *
35 * Stanford disclaimer of liability
36 * --------------------------------
37 * Stanford University makes no representations or warranties, express or
38 * implied, nor assumes any liability for the use of this software.
39 *
40 * Stanford disclaimer of copyright
41 * --------------------------------
42 * Stanford University, owner of the copyright, hereby disclaims its
43 * copyright and all other rights in this software.  Hence, anyone may
44 * freely use it for any purpose without restriction.
45 *
46 * Maintenance of notices
47 * ----------------------
48 * In the interest of clarity regarding the origin and status of this
49 * SLAC software, this and all the preceding Stanford University notices
50 * are to remain affixed to any copy or derivative of this software made
51 * or distributed by the recipient and are to be affixed to any copy of
52 * software made or distributed by the recipient that contains a copy or
53 * derivative of this software.
54 *
55 * ------------------ SLAC Software Notices, Set 4 OTT.002a, 2004 FEB 03
56 */
57
58#ifdef __cplusplus
59  extern "C" {
60#endif
61
62#include <rtems.h>
63#include <rtems/libi2c.h>
64
65/* for registration with libi2c */
66extern rtems_libi2c_bus_t *mpc8540_i2c_bus_descriptor;
67
68#ifdef __cplusplus
69  }
70#endif
71
72#endif
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